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专利名称：Optical device and assembly for use with
imaging dies, and wafer-label imagerassembly
发明人：Salman Akram申请号：US11209524申请日：20050822公开号：US07511262B2公开日：20090331
专利附图：
摘要：Microelectronic imagers with integrated optical devices and methods formanufacturing imagers. The imagers, for example, typically have an imaging unit including
a first substrate and an image sensor on and/or in the first substrate. An embodiment ofan optical device includes a stand-off having a compartment configured to contain theimage sensor. The stand-off has a coefficient of thermal expansion at least substantiallythe same as that of the first substrate. The optical device can further include an opticselement in alignment with the compartment of the stand-off. The stand-off can beformed by etching a compartment into a silicon wafer or a wafer of another materialhaving a coefficient of thermal expansion at least substantially the same as that of thesubstrate upon which the image sensor is formed. The optics elements can be formedintegrally with the stand-offs or separately attached to a cover supported by the stand-offs.
申请人：Salman Akram
地址：Boise ID US
国籍：US
代理机构：Dickstein Shapiro LLP
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