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专利名称：LED packaging structure and production
method thereof
发明人：Steven Lo申请号：US11936824申请日：20071108
公开号：US20090121244A1公开日：20090514
专利附图：
摘要：An LED packaging structure and a production method thereof; the LEDpackaging structure includes an LED die placed on a metal substrate and packed withseal in conjunction with a transparent substrate to deliver advantages of compact,
simplified process and long service life and provide significant advancement and industrialvalue when compared to the prior art.
申请人：Steven Lo
地址：Jhubei City TW
国籍：TW
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