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SMD Inductors(Coils)
For Signal Line(Multilayer, Magnetic Shielded)
MLF Series MLF2012
FEATURES
•High-reliability monolithic structure.
•Ferrite core and magnetic shielding enables the design of com-pact circuits with high packing density.
•Excellent solderability and high heat resistance permits either flow or reflow soldering.
•The products contain no lead and also support lead-free soldering.
•It is a product conforming to RoHS directive.
APPLICATIONS
Digital cellular phone, car audio, TV, personal computers, or vari-ous electronic appliances.SPECIFICATIONS
Operating temperature rangeStorage temperature range
–25 to +85°C
–40 to +85°C[Unit of products]
Conformity to RoHS Directive
PRODUCT IDENTIFICATIONMLF2012A1R0K T(1) (2) (3) (4) (5) (6)(1) Series name(2) Dimensions L×W
2012
2.0×1.25mm
(3) Material code(4) Inductance value
47NR151R0100
47nH[0.047µH]0.15µH1µH10µH
(5) Inductance tolerance
RECOMMENDED SOLDERING CONDITIONREFLOW SOLDERING
KM
±10%±20%
(6) Packaging style
10s max.250 to 260˚C230˚C180˚C150˚CPreheating60 to 120sTime(s)Soldering30 to 60sNaturalcoolingTTaping [reel]
PACKAGING STYLE AND QUANTITIES
Packaging styleTaping
Product’s thickness0.85mm1.25mm
Quantity
4000 pieces/reel2000 pieces/reel
HANDLING AND PRECAUTIONS
•Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-ture difference between the solder temperature and product temperature does not exceed 150°C.
•After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling.
•The inductance value may change due to magnetic saturation if the current exceeds the rated maximum.
•Do not expose the inductors to stray magnetic fields.•Avoid static electricity discharge during handling.
•When hand soldering, apply the soldering iron to the printed cir-cuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds.
•Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.•Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
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SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN
1.212.60.5±0.3TT0.85±0.21.25±0.2Weight(mg)1014Dimensions in mm2+0.3, –0.11.25±0.2ELECTRICAL CHARACTERISTICS
Inductance(µH)0.0470.0680.0820.10.120.150.180.220.270.330.390.470.560.680.8211.21.51.82.22.73.33.94.75.66.88.2101215182227333947566882100
∗2
Inductancetolerance±20%±20%±20%
±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%±20, ±10%
Qmin.15151520202020202020252525252545454545454545454550505050503030303030353535252525
typ.25252530303030303030353535353555556060607070707075757575754545454545555555454545
Test
frequencyL, Q (MHz)5050502525252525252525252525251010101010101010104442211110.4222111Test currentL, Q (mA)1.01.01.01.01.01.01.01.01.01.01.01.01.01.01.01.01.01.01.01.01.01.01.01.00.10.10.10.10.10.10.10.10.10.10.10.10.10.10.10.1Self-resonantfrequency (MHz)min.typ.55070050060045055040050036045032041028037025033022030020027018025016023015021014019013017012016011015010014090130801207010060905580507045654060355530502545224020381835173315281323112010116814712DC resistanceRated
(Ω)current
(mA)max.max.typ.
0.100.05 3000.150.08 3000.150.08 3000.150.10 3000.200.12 3000.200.13 3000.250.15 3000.300.16 2500.350.18 2500.400.23 2500.450.25 2000.500.25 2000.550.30 1500.600.35 1500.650.40 1500.300.15 800.350.15 800.400.18 800.450.20 800.500.22 500.550.25 500.600.28 500.650.30 300.700.35 300.600.30 150.650.32 150.700.35 150.800.40 150.900.50 150.700.35 50.800.38 50.900.45 51.000.50 51.100.55 52.401.30 42.701.60 42.801.80 42.902.00 23.002.40 23.102.50 2Thickness
T (mm)0.850.850.850.850.850.850.850.850.850.850.851.251.251.251.250.850.850.850.850.851.251.251.251.251.251.251.251.251.251.251.251.251.251.251.251.251.251.251.251.25
Part No.
MLF2012D47N∗1MTMLF2012D68NMTMLF2012D82NMTMLF2012DR10∗2TMLF2012DR12TMLF2012DR15TMLF2012DR18TMLF2012DR22TMLF2012DR27TMLF2012DR33TMLF2012DR39TMLF2012DR47TMLF2012DR56TMLF2012DR68TMLF2012DR82TMLF2012A1R0TMLF2012A1R2TMLF2012A1R5TMLF2012A1R8TMLF2012A2R2TMLF2012A2R7TMLF2012A3R3TMLF2012A3R9TMLF2012A4R7TMLF2012E5R6TMLF2012E6R8TMLF2012E8R2TMLF2012E100TMLF2012E120TMLF2012C150TMLF2012C180TMLF2012C220TMLF2012C270TMLF2012C330TMLF2012K390TMLF2012K470TMLF2012K560TMLF2012C680TMLF2012C820TMLF2012C101T
∗1 47N means for 47nH (0.047µH).
: Please specify inductance tolerance, M(±20%) or K(±10%)•Test equipment
Inductance, Q: Ag4294A-16034G
• All specifications are subject to change without notice.
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TYPICAL ELECTRICAL CHARACTERISTICS
INDUCTANCE CHANGE vs. DC SUPERPOSITIONCHARACTERISTICS
100IMPEDANCE vs. FREQUENCY CHARACTERISTICS
10022µH1010µH10Inductance(µH)11µHImpedance(kΩ)122µH10µH1µH0.1µH0.10.1µH0.10.01151050100DC current(mA)50010000.01151050100Frequency(MHz)5001000INDUCTANCE CHANGE vs. TEMPERATURECHARACTERISTICS
∆L/L(%)12841µH10µH0.1µH22µH85Q vs. FREQUENCY CHARACTERISTICS
8060Q4020010µH1µH0.1µH22µH–2522µH0.1µH1µH10µH002550–4Temperature(˚C)–8–12–160.10.5151050100Frequency(MHz)5001000PACKAGING STYLESREEL DIMENSIONS
TAPE DIMENSIONSt=0.85mm1.75±0.12.3±0.2Cavity1.75±0.1300min.Dimensions in mm2.3±0.23.5±0.058.0±0.30.3max.1.5±0.24.0±0.12.0±0.05160min.Taping200min.4.0±0.1Drawing direction3.5±0.058.0±0.31.1max.1.5±0.24.0±0.12.0±0.054.0±0.11.0Sprocket hole1.5+0.1–0.0Cavityø60±2.02.0±0.5ø13±0.5ø21±0.8ø178±2.09.0±0.313.0±1.4t=1.25mm1.5max.Sprocket hole1.5+0.1–0.00.5min.Dimensions in mm• All specifications are subject to change without notice.
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