专利内容由知识产权出版社提供
专利名称：System and method for cleaning
semiconductor fabrication equipment parts
发明人：Samantha Tan申请号：US10961572申请日：20041008
公开号：US20050085400A1公开日：20050421
专利附图：
摘要：A process for cleaning semiconductor fabrication equipment parts includesdetermining a definition for a clean part including multiple maximum acceptable impuritylevels; determining an initial multiple impurity levels of a part prior to its cleaning;
determining a cleaning process to apply to the part; applying the cleaning process to thepart, wherein the cleaning process creates reduced multiple impurity levels for the partbelow that of the initial multiple impurity levels; determining the reduced multipleimpurity levels; comparing the reduced multiple impurity levels against the multiplemaximum acceptable impurities levels of the definition; and repeating the application ofthe cleaning process to the part if the reduced multiple impurity levels do not meet thedefinition of a clean part. A dilute aqueous cleaning solution for cleaning parts includes0.5-1.5% wt. HF; 0.1-0.5% wt. HNO; and 1-10% wt HO. A method for reducing sub-surfacedamage to a part includes determining how deep is the sub-surface damage beneath asurface of a part; chemically etching said surface of said part; and stopping said chemicaletching of said surface at about said depth of said sub-surface damage.
申请人：Samantha Tan
地址：Union City CA US
国籍：US
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