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专利名称：Multi-chip semiconductor device with
specific chip arrangement
发明人：Yasuhiro Naka,Naotaka Tanaka,Ikuo
Yoshida,Satoshi Imasu,Takahiro Naito
申请号：US10117845申请日：20020405公开号：US06800945B2公开日：20041005
专利附图：
摘要：In a multi-chip-module type semiconductor device, first and secondsemiconductor elements, a main component of each of the semiconductor elements
being semiconductor material to form a semiconductor electric circuit in each of thesemiconductor elements, are mounted on and electrically connected to a substrateadapted to be mounted onto a mother board and to be electrically connected to themother board so that the each of the semiconductor elements is electrically connectedto the mother board through the substrate.
申请人：HITACHI, LTD.
代理机构：Townsend and Townsend and Crew LLP
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