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专利名称：DIE SORTING APPARATUS AND DIE
SORTING METHOD
发明人：CHEN YANG,XIN XING BAI申请号：US15687209申请日：20170825
公开号：US20180068880A1公开日：20180308
专利附图：
摘要：A die sorting apparatus includes a fixing mechanism for fixing a wafer having aplurality of dies, a positioning mechanism including an indicator for selecting a die of thewafer using die coordinates, an ejection mechanism below the wafer for applying a force
to the selected die, a moving mechanism mechanically coupled to the positioningmechanism and the ejection mechanism for aligning the positioning mechanism with theejection mechanism according to the die coordinates. The ejection mechanism includes anejection shaft, a pin driven by the ejection shaft to apply the force to the selected die,and a pin driving device for moving the pin up and down through the ejection shaft. Thedie sorting apparatus also includes a die pickup device mounted in parallel to or
integrated in the positioning mechanism for picking up the selected die that is separatedform the wafer through the pin.
申请人：SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI)CORPORATION,SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING)CORPORATION
地址：Shanghai CN,Beijing CN
国籍：CN,CN
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