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专利名称：STACKED DIE PACKAGE发明人：Shih-Hsuan LIN,Hung-Yi WANG申请号：US12132788申请日：20080604
公开号：US20090302483A1公开日：20091210
专利附图：
摘要：The invention provides a stacked die package. The package includes a leadframe having a plurality of the leads and a stack of dice disposed thereon, in which theupper die may be electrically connected to the leads via at least one transit area on thelower die to transfer a power signal or a ground signal.
申请人：Shih-Hsuan LIN,Hung-Yi WANG
地址：Tainan County TW,Tainan County TW
国籍：TW,TW
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