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专利名称：Stacked die package
发明人：Juan G. Milla,Robert L. Hubbard申请号：US10413320申请日：20030415公开号：US07045390B2公开日：20060516
专利附图：
摘要：A stacked die package is formed by stiffening a flexible substrate, arranging achip mounting pattern on one side of the substrate, and mounting chips according to thearranged pattern. A solder ball array on the opposite side of the substrate is routed tothe chips, and the flexible substrate and stiffener are folded to align the chips in the
stacked die package. The stiffener is removed by a single saw cut.
申请人：Juan G. Milla,Robert L. Hubbard
地址：Mesa AZ US,Mesa AZ US
国籍：US,US
代理人：Girma Wolde-Michael,Caroline F. Barry
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