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专利名称：Stacked Die Package发明人：Torsten Meyer,Harry Hedler申请号：US12014632申请日：20080115
公开号：US20080128884A1公开日：20080605
专利附图：
摘要：A stacked die package includes a substrate or interposer board that includes acontact area on a top surface and landing pads surrounding the contact area. Solder padsare disposed on an opposite side of the substrate. The solder pads are electricallyconnected with the landing pads by inner board wiring. A reconstituted die, which
includes a die surrounded by a frame, is mounted over the substrate. A top die ismounted over the reconstituted die. Both the reconstituted die and the top die areelectrically connected to the substrate, e.g., by wire bonds.
申请人：Torsten Meyer,Harry Hedler
地址：Erlangen DE,Germering DE
国籍：DE,DE
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